H05K 2201/09845
Stepped hole, via, edge, bump or conductor
H05K2201/09845 (Stepped hole, via, edge, bump or conductor) appears on 727 US grants and 761 published applications in this corpus.
Search patents in H05K- Granted patents
- 727
- Published applications
- 761
- Assignees
- 363
- Inventors
- 1,734
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 8 | 0 |
| 1994 | 7 | 0 |
| 1995 | 11 | 0 |
| 1996 | 7 | 0 |
| 1997 | 11 | 0 |
| 1998 | 9 | 0 |
| 1999 | 10 | 0 |
| 2000 | 11 | 0 |
| 2001 | 11 | 12 |
| 2002 | 23 | 9 |
| 2003 | 14 | 17 |
| 2004 | 12 | 19 |
| 2005 | 15 | 35 |
| 2006 | 19 | 34 |
| 2007 | 20 | 29 |
| 2008 | 20 | 46 |
| 2009 | 15 | 48 |
| 2010 | 28 | 35 |
| 2011 | 35 | 35 |
| 2012 | 31 | 34 |
| 2013 | 31 | 26 |
| 2014 | 32 | 34 |
| 2015 | 27 | 60 |
| 2016 | 36 | 39 |
| 2017 | 39 | 34 |
| 2018 | 38 | 34 |
| 2019 | 28 | 28 |
| 2020 | 36 | 27 |
| 2021 | 21 | 29 |
| 2022 | 23 | 21 |
| 2023 | 16 | 21 |
| 2024 | 18 | 25 |
| 2025 | 17 | 18 |
| 2026 | 8 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board assembly, manufacturing method, and electronic device28 Jul 2026US 12,696,393 B2Honor Device Co., Ltd.
- Methods of manufacture of multi-diameter female contacts with a circuit board30 Jun 2026US 12,672,242 B2Eagle Technology, LLC
- Printed wiring board9 Jun 2026US 12,652,755 B2Ibiden Co., Ltd.
- Printed wiring board2 Jun 2026US 12,648,081 B2Ibiden Co., Ltd.
- Wiring substrate2 Jun 2026US 12,648,468 B2Shinko Electric Industries Co., Ltd.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Circuit board device24 Sep 2026US 2026/0292971 A1Global Unichip Corporation
- Camera module and electronic device comprising same17 Sep 2026US 2026/0282235 A1Samsung Electronics Co., Ltd.
- Power pin assembly structure of electronic device and manufacturing process for substrate thereof23 Jul 2026US 2026/0214797 A1MetaPWR Electronics Co., Ltd.
- Electronic device and metal heat dissipation9 Jul 2026US 2026/0197931 A1Wistron Neweb Corp.
Most cited
By later US patents
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000
- Semiconductor interconnect having laser machined contacts223US 6,294,837 B1Micron Technology, Inc. · 2001