Electronic device and metal heat dissipation

Abstract

An electronic device and a metal heat dissipation member are provided. The electronic device includes a metal heat dissipation member, a conductive member, a circuit substrate, and an electronic component. The metal heat dissipation member includes a groove. The groove includes a receiving portion and at least one through hole located around the receiving portion. The conductive member is disposed in the receiving portion. The circuit substrate is disposed above the metal heat dissipation member. The circuit substrate has an opening corresponding to the groove, and the conductive member is exposed from the opening. The electronic component is disposed above the circuit substrate and the conductive member, and the conductive member is configured to connect the electronic component and the metal heat dissipation member.

Dependencies are inferred from the claim text.