Circuit board device

A circuit board device, comprising:

• a multilayer board structure comprising a core layer, at least one first plate layer and a plurality of second plate layers stacked one another, and the core layer that is sandwiched between the at least one first plate layer and the second plate layers;
• and
• a plurality of differential pair routings, each of the differential pair routings comprising:
• a first plating through hole (first PTH) comprising a first conductive hole and a first laser through hole, the first conductive hole that is located within the core layer, and the first laser through hole that is sequentially passing through the second plate layers and electrically connected to the first conductive hole;
• and
• a second plating through hole (second PTH) comprising a second conductive hole and a second laser through hole, the second conductive hole that is located within the core layer, and the second laser through hole that is sequentially passing through the second plate layers and electrically connected to the second conductive hole,
• wherein when viewed in cross-sectional view:
• a pattern of the first PTH and a pattern of the second PTH are mirror-symmetrical to each other, the second conductive hole is parallel to the first conductive hole, and a first spacing is formed between the second conductive hole and the first conductive hole, the first laser through hole and the second laser through hole are completely between an imaginary extension line of the first conductive hole and an imaginary extension line of the second conductive hole, and a second spacing defined between the first laser through hole and the second laser through hole is smaller than the first spacing.