Power pin assembly structure of electronic device and manufacturing process for substrate thereof

A power pin assembly structure of an electronic device, comprising a substrate and a power pin;

• the substrate comprises a plated through hole, an upper surface and a lower surface opposite to each other;
• the plated through hole penetrates the upper surface and the lower surface of the substrate;
• the plated through hole comprises a first through-hole portion, a second through-hole portion, a welding portion and a metallization layer;
• a cross-sectional area of the second through-hole portion is smaller than a cross-sectional area of the first through-hole portion, and the first through-hole portion and the second through-hole portion are stacked to form a stepped hole;
• the welding portion is disposed on the lower surface of the substrate;
• the metallization layer is disposed on a sidewall of the first through-hole portion and a region extending from the sidewall of the first through-hole portion towards the second through-hole portion;
• the power pin comprises a first implantation portion, a support surface, and a support portion;
• the support surface is connected to the first implantation portion and the support portion;
• a cross-sectional area of the first implantation portion is smaller than a cross-sectional area of the support portion;
• the first through-hole portion is used for accommodating the first implantation portion of the power pin, and a sidewall of the first implantation portion and the sidewall of the first through-hole portion are fixed and electrically connected by means of solder;
• and the support surface and the welding portion are fixed and electrically connected by means of solder.