H05K 2201/09918
Optically detected marks used for aligning tool relative to the pcb
Official title: Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
H05K2201/09918 (Optically detected marks used for aligning tool relative to the pcb) appears on 515 US grants and 555 published applications in this corpus.
Search patents in H05K- Granted patents
- 515
- Published applications
- 555
- Assignees
- 294
- Inventors
- 1,163
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
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| 1978 | 1 | 0 |
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| 2000 | 9 | 0 |
| 2001 | 10 | 10 |
| 2002 | 9 | 20 |
| 2003 | 18 | 23 |
| 2004 | 20 | 19 |
| 2005 | 13 | 35 |
| 2006 | 29 | 31 |
| 2007 | 11 | 34 |
| 2008 | 27 | 38 |
| 2009 | 19 | 43 |
| 2010 | 20 | 37 |
| 2011 | 27 | 23 |
| 2012 | 28 | 29 |
| 2013 | 21 | 17 |
| 2014 | 23 | 18 |
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| 2017 | 21 | 14 |
| 2018 | 10 | 19 |
| 2019 | 15 | 9 |
| 2020 | 17 | 21 |
| 2021 | 15 | 16 |
| 2022 | 15 | 17 |
| 2023 | 14 | 16 |
| 2024 | 6 | 8 |
| 2025 | 12 | 10 |
| 2026 | 4 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device and method of manufacturing the same7 Jul 2026US 12,677,567 B2Samsung Display Co., Ltd.
- Display device16 Jun 2026US 12,656,644 B2Samsung Display Co., Ltd.
- Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same17 Feb 2026US 12,557,209 B2Samsung Electronics Co., Ltd.
- Display module and mobile terminal6 Jan 2026US 12,520,430 B2Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Manufacturing component carrier with cavity by trimming poorly adhesive structure before removing stack material23 Dec 2025US 12,507,350 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Display device and method of manufacturing the same24 Sep 2026US 2026/0293498 A1Samsung Display Co., Ltd.
- Precision alignment features for high density interconnects16 Jul 2026US 2026/0206605 A1Raytheon Company
- Pattern recognition system and method for digital printed circuit board assembly9 Jul 2026US 2026/0197945 A1National Technical University of Athens
- Semiconductor package2 Jul 2026US 2026/0191054 A1Samsung Electronics Co., Ltd.
- Multilayer board25 Jun 2026US 2026/0181775 A1Alps Alpine Co., Ltd.
Most cited
By later US patents
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- High-frequency module and method for manufacturing the same165US 7,081,661 B2Matsushita Electric Industrial Co., Ltd. · 2006
- High-frequency module and method for manufacturing the same154US 7,125,744 B2Matsushita Electric Industrial Co., Ltd. · 2006
- Blind via laser drilling system115US 6,211,485 B12001
- Blind via laser drilling system91US 6,631,558 B2Laservia Corporation · 2003