Blind via laser drilling system
OwnerLarry W. Burgessinventor
Life of this patent
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Abstract
A laser drilling system for producing blind vias (13) in multilayered circuit boards (9) includes an RF excited sealed carbon dioxide laser oscillator (19), X-Y motion table for moving the boards during on-the-fly via formation, and a controller. A laser beam (20) is focused beneath the circuit board by a long focal length lens (17) so as to be defocused at the surface of the board. A slotted mask may be used to allow drilling of multiple vias simultaneously, air may be injected to the via to assist in material removal, glass scales may be used for feedback position control, both the mask and table may be rotatable, and a computer may be used for determining an optimal processing path.
Claims20
A laser drilling system for drilling blind vias in printed circuit board panel which includes multiple dielectric polymer and metal layers, the system comprising:
- an RF excited CO2 laser of at least 100 watts with the capability to pulse at least 5,000 times per second to form at least one via per pulse through one or more polymer layers;
- an X and Y axis position control system including a table for supporting a panel relative to the laser for drilling and a motion controller;
- and
- a controller that outputs a signal to the motion controller and receives location input from the controller to actuate the laser.
Dependencies are inferred from the claim text.