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US 7,081,661 B2Granted
High-frequency module and method for manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHideki Takehara, Noriyuki Yoshikawa, Kunihiko Kanazawa
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Abstract
In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.
Claims9
A high-frequency module comprising:
- a substrate;
- a high-frequency circuit that is mounted on a surface of the substrate and comprises a high-frequency semiconductor element, the high-frequency circuit comprising a wiring pattern connected to a ground potential;
- an insulating resin formed so as to seal at least the high-frequency semiconductor element and to have a rectangular surface, the insulating resin comprising an aperture exposing the wiring pattern;
- and
- a metal thin film formed on an upper surface of the insulating resin,
- wherein the wiring pattern is electrically connected to the metal thin film at the aperture.
3 more elements
Dependencies are inferred from the claim text.