Manufacturing component carrier with cavity by trimming poorly adhesive structure before removing stack material
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsJeffrey Jiang, Allen Zhao, Artan Baftiri
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.
Claims19
A method of manufacturing a component carrier, the method comprising:
- forming a poorly adhesive structure on at least one layer structure;
- thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure;
- thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure;
- and
- forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure;
- wherein removing part of the poorly adhesive structure comprises removing part of the poorly adhesive structure at two opposing sides of the poorly adhesive structure.
A method of manufacturing a component carrier, the method comprising:
- forming a poorly adhesive structure on at least one layer structure;
- thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure;
- thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure;
- and
- forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure, further comprising:
- forming a functional coating on at least part of a surface which delimits the cavity.
A method of manufacturing a component carrier, the method comprising:
- forming a poorly adhesive structure on at least one layer structure;
- thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure;
- thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure;
- and
- forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure,
- wherein the method comprises adjusting a roughness Rz of a metallic surface along at least part of a circumference of a bottom surface of the cavity to be lower than a roughness Rz of a metallic surface in a central portion of the bottom surface of the cavity.
Dependencies are inferred from the claim text.