High-frequency module and method for manufacturing the same

A method for manufacturing a high-frequency module, comprising:

• a substrate;
• a high-frequency circuit that is mounted on a surface of the substrate and comprises a high-frequency semiconductor element;
• an insulating resin formed so as to seal at least the high-frequency semiconductor element;
• and
• a metal thin film formed on a surface of the insulating resin,
• wherein the high-frequency circuit further comprises a wiring pattern;
• the wiring pattern is electrically connected to the metal thin film;
• the surface of the substrate comprises a first region in which the insalating resin is formed and a second region in which no insulating resin is formed;
• and
• the wiring pattern exposed at the surface of the substrate in the second region is electrically connected to the metal thin film, the method comprising
• forming the insulating resin by molding and exposing a part of the wiring pattern at the surface of the substrate by irradiation with a laser beam or mechanical grinding performed after the molding of the insulating resin, wherein
• the irradiation with the laser beam or the mechanical grinding is performed after positioning with a mark that has been preformed on a face opposite to the surface of the substrate on which the high-frequency circuit is disposed.