H05K 2201/09854
Hole or via having special cross-section
Official title: Hole or via having special cross-section, e.g. elliptical
H05K2201/09854 (Hole or via having special cross-section) appears on 355 US grants and 550 published applications in this corpus.
Search patents in H05K- Granted patents
- 355
- Published applications
- 550
- Assignees
- 225
- Inventors
- 984
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 1 |
| 2002 | 8 | 8 |
| 2003 | 7 | 9 |
| 2004 | 6 | 5 |
| 2005 | 2 | 3 |
| 2006 | 5 | 10 |
| 2007 | 4 | 14 |
| 2008 | 4 | 9 |
| 2009 | 5 | 13 |
| 2010 | 9 | 17 |
| 2011 | 2 | 15 |
| 2012 | 11 | 24 |
| 2013 | 18 | 25 |
| 2014 | 15 | 32 |
| 2015 | 22 | 32 |
| 2016 | 25 | 29 |
| 2017 | 22 | 17 |
| 2018 | 16 | 24 |
| 2019 | 26 | 17 |
| 2020 | 24 | 34 |
| 2021 | 18 | 17 |
| 2022 | 19 | 23 |
| 2023 | 11 | 19 |
| 2024 | 19 | 31 |
| 2025 | 17 | 11 |
| 2026 | 8 | 111 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board11 Aug 2026US 12,707,559 B2LG Innotek Co., Ltd.
- Circuit board, electronic device having the circuit board and method of manufacturing the electronic device7 Jul 2026US 12,677,372 B2Quan Mei Technology Co., Ltd.
- Conductive film and display panel12 May 2026US 12,628,268 B2Tcl China Star Optoelectronics Technology Co., Ltd.
- Package substrate including core with trench vias and planes5 May 2026US 12,621,937 B2Intel Corporation
- Printed circuit board7 Apr 2026US 12,598,702 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board with embedded smd device24 Sep 2026US 2026/0292994 A1Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Component Carrier and Method of Manufacturing a Component Carrier20 Aug 2026US 2026/0247999 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Metallized ceramic circuit board and manufacturing method thereof23 Jul 2026US 2026/0214794 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Electronic assembly with trench structures and methods of manufacture145US 6,388,207 B1Intel Corporation · 2002
- EMI/RFI shielding method and apparatus101US 5,014,160 ADigital Equipment Corporation · 1991
- Method for fabricating highly conductive vias97US 5,619,791 ALucent Technologies Inc. · 1997
- Revenue meter with a graphic user interface being operative to display scalable objects71US 6,798,191 B1Power Measurement Ltd. · 2004
- Method of making a device including a metallized magnetic substrate64US 5,802,702 ALucent Technologies Inc. · 1998