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US 2026/0292994 A1Published application
Printed circuit board with embedded smd device
AssigneeLittelfuse Semiconductor (Wuxi) Co., Ltd.
InventorsChuan Fang Chin, Jordan Hsieh
Life of this patent
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Abstract
A printed circuit board (PCB) assembly is disclosed. The printed circuit board assembly may include a PCB body, as well as a set of vias, disposed within the PCB body. The printed circuit board assembly may further include a set of devices, disposed within the set of vias, respectively.
Claims16
A printed circuit board (PCB) assembly, comprising:
- a PCB body;
- a set of vias, disposed within the PCB body;
- and
- a set of devices, disposed within the set of vias, respectively.
1 more element
A printed circuit board (PCB) assembly, comprising:
- a PCB body, the PCB body comprising:
- a plurality of substrate layers, formed of an insulating material;
- and
- a plurality of embedded conductive layers arranged in an alternating fashion between with the plurality of substrate layers;
- and
- a plurality of device vias, disposed within the PCB body, wherein each device via includes a device, disposed therein.
3 more elements
Dependencies are inferred from the claim text.