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US 12,621,937 B2Granted
Package substrate including core with trench vias and planes
AssigneeIntel Corporation
InventorTelesphor Kamgaing
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.
Claims31
A package substrate, comprising:
- a core substrate;
- a hole into the core substrate, and a trench into the core substrate, the trench laterally spaced apart from the hole, wherein the hole does not pass entirely through a thickness of the core substrate;
- a via in the hole, wherein the via completely fills the hole, and wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate;
- and
- a via plane in the trench.
2 more elements
A method of forming a package substrate, comprising:
- exposing a region of a core substrate with a laser, wherein the laser changes the morphology of the exposed region;
- etching the core substrate, wherein the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate, and to form a trench into the core substrate, the trench laterally spaced apart from the hole;
- forming a via in the hole, wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate;
- and
- forming a via plane in the trench.
2 more elements
An electronic package, comprising:
- a package substrate, wherein the package substrate comprises:
- a core substrate that comprises a glass section with a via through the glass section, wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate, and the glass section having a via plane through the glass section, the via plane laterally spaced apart from the via;
- and
- a buildup layer over the core substrate;
- and
- a die coupled to the package substrate, wherein the die is electrically coupled to the via;
- and
- a board, wherein the package substrate is coupled to the board.
5 more elements
A package substrate, comprising:
- a core substrate, wherein the core substrate comprises a glass, and wherein the glass is a photo-definable glass;
- a hole into the core substrate, and a trench into the core substrate, the trench laterally spaced apart from the hole;
- a via in the hole, wherein the via completely fills the hole, and wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate;
- and
- a via plane in the trench.
2 more elements
A package substrate, comprising:
- a core substrate;
- a hole into the core substrate, wherein the hole has sidewalls that are sloped, and a trench into the core substrate, the trench laterally spaced apart from the hole;
- a via in the hole, wherein the via completely fills the hole, and wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate;
- and
- a via plane in the trench.
2 more elements
A package substrate, comprising:
- a core substrate;
- a hole into the core substrate, wherein the hole is elongated to form a trench into the core substrate, and a trench into the core substrate, the trench laterally spaced apart from the hole;
- a via in the hole, wherein the via completely fills the hole, and wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate;
- and
- a via plane in the trench.
2 more elements
A package substrate, comprising:
- a core substrate;
- a hole into the core substrate, wherein the hole is rectangular, and a trench into the core substrate, the trench laterally spaced apart from the hole;
- a via in the hole, wherein the via completely fills the hole, and wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate;
- and
- a via plane in the trench.
2 more elements
A package substrate, comprising:
- a core substrate;
- a hole into the core substrate, wherein the hole is rectangular with rounded ends, and a trench into the core substrate, the trench laterally spaced apart from the hole;
- a via in the hole, wherein the via completely fills the hole, and wherein the via has an outermost surface at a same level as an outermost surface of the core substrate, the outermost surface of the via having a maximum diameter less than a vertical thickness of the via through the core substrate;
- and
- a via plane in the trench.
2 more elements
Dependencies are inferred from the claim text.