H05K 2201/0989
Coating free areas
Official title: Coating free areas, e.g. areas other than pads or lands free of solder resist
H05K2201/0989 (Coating free areas) appears on 429 US grants and 456 published applications in this corpus.
Search patents in H05K- Granted patents
- 429
- Published applications
- 456
- Assignees
- 205
- Inventors
- 985
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 8 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 18 | 5 |
| 2002 | 14 | 13 |
| 2003 | 17 | 15 |
| 2004 | 9 | 21 |
| 2005 | 9 | 44 |
| 2006 | 21 | 30 |
| 2007 | 18 | 52 |
| 2008 | 28 | 41 |
| 2009 | 25 | 45 |
| 2010 | 31 | 34 |
| 2011 | 28 | 13 |
| 2012 | 21 | 13 |
| 2013 | 15 | 4 |
| 2014 | 9 | 9 |
| 2015 | 8 | 12 |
| 2016 | 10 | 5 |
| 2017 | 10 | 11 |
| 2018 | 7 | 11 |
| 2019 | 7 | 8 |
| 2020 | 15 | 10 |
| 2021 | 10 | 11 |
| 2022 | 8 | 12 |
| 2023 | 13 | 5 |
| 2024 | 6 | 10 |
| 2025 | 7 | 15 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and method for manufacturing circuit board28 Apr 2026US 12,615,713 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Circuit board3 Mar 2026US 12,568,574 B2Panasonic Intellectual Property Management Co., Ltd.
- Circuit board with a partial solder-mask and at least one conformal-coating3 Mar 2026US 12,568,588 B1Salvia BioElectronics B.V.
- Semiconductor package and semiconductor device30 Sep 2025US 12,431,439 B2Kioxia Corporation
- Method for applying a protective layer to a circuit-board assembly2 Jul 2026US 2026/0190247 A1Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg
- Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the same25 Jun 2026US 2026/0182422 A1Qorvo US, Inc.
- Protection circuit module and battery pack21 May 2026US 2026/0142355 A1Samsung SDI.Co., Ltd.
- Led lighting device7 May 2026US 2026/0126162 A1Xiamen PVTECH Co., Ltd.
- Circuit board with semi-solder mask defined pad and method of manufacturing same16 Apr 2026US 2026/0107382 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Solder ball land metal structure of ball grid semiconductor package176US 5,872,399 AAmkor Technology, Inc. · 1999
- Method of controlling solder ball size of BGA IC components152US 5,519,580 AIntel Corporation · 1996
- Making solder ball mounting pads on substrates132US 6,201,305 B1Amkor Technology, Inc. · 2001
- PCB design and method for providing vented blind vias122US 6,787,443 B1Intel Corporation · 2004
- Substrate with reinforced contact pad structure116US 7,005,750 B2Advanced Semiconductor Engineering, Inc. · 2006