Method for applying a protective layer to a circuit-board assembly
AssigneeBrose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg
InventorGiulia WENDELIN
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Abstract
A method for applying a protective layer to a circuit-board assembly. The circuit-board assembly has at least one protective-layer area on which the protective layer is to be applied, and at least one free area, arranged outside the protective-layer area. In a first method step, a specified amount of the protective layer is applied in the free area. In a subsequent, second method step, the protective layer is applied to the protective-layer area.
Claims6
1-5. (canceled)
A method for applying a protective layer to a circuit-board assembly, the method comprising:
- providing the circuit-board assembly with at least one protective-layer area, on which the protective layer is to be applied, and at least one free area arranged outside the protective-layer area;
- in a first method step, applying a specified amount of the protective layer in the at least one free area;
- and
- in a subsequent, second method step, applying the protective layer (34) to the protective-layer area.
A circuit-board assembly carrying electronics of an electric refrigerant drive, the circuit board assembly comprising:
- at least one protective-layer area and at least one free area;
- and a protective layer applied in said protective-layer area and in said free area.
Dependencies are inferred from the claim text.