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US 6,787,443 B1Granted
PCB design and method for providing vented blind vias
AssigneeIntel Corporation
InventorsDavid W. Boggs, John H. Dungan, Gary I. Paek, Daryl A. Sato
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Abstract
An apparatus and method for providing a vented blind via in pad of a printed circuit board (PCB). A vent in the blind via in pad to allow gases formed during reflow soldering to escape from the solder joint. In one embodiment, the vent extends from the outer edge of the pad to the blind via. In another embodiment, a method includes forming a blind via in pad having a vent.
Claims6
A method, comprising:
- providing a multilayer assembly wherein an outer conductive layer is coupled to a multilayer substrate, the multilayer substrate including at least two layers of substrate and an inner conductive layer;
- forming a window into the outer conductive layer;
- forming a blind via in the window to expose the inner conductive layer by removing one or more layers of substrate;
- and
- forming a blind via in pad in the outer conductive layer, the blind via in pad including a pad formed over the blind via, the pad including a vent to allow gas to escape the blind via in pad.
2 more elements
Dependencies are inferred from the claim text.