Circuit board with semi-solder mask defined pad and method of manufacturing same
AssigneeSTMicroelectronics International N.V.
InventorWilliam HALLIDAY
Life of this patent
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Abstract
In accordance with various embodiments of the present disclosure, a circuit board is provided that comprises a substrate, a metal layer covering a portion of the substrate and forming at least one metal pad, and a solder mask at least partly covering the metal layer and defining at least one opening. The at least one opening corresponds to the at least one metal pad such that opposing first and second edges of the metal pad are exposed within the at least one opening and opposing third and fourth edges of the metal pad are covered by the solder mask.
Claims20
A circuit board comprising:
- a substrate;
- a metal layer covering a portion of the substrate and forming at least one metal pad;
- and
- a solder mask at least partly covering the metal layer and defining at least one opening, the at least one opening corresponding to the at least one metal pad such that opposing first and second edges of the metal pad are exposed within the at least one opening and opposing third and fourth edges of the metal pad are covered by the solder mask.
A circuit board comprising:
- a substrate;
- a metal layer covering a portion of the substrate and forming at least one metal pad;
- and
- a solder mask at least partly covering the metal layer and defining at least one opening, the at least one opening corresponding to the at least one metal pad such that opposing first and second edges of the metal pad are exposed within the at least one opening and opposing third and fourth edges of the metal pad are covered by the solder mask;
- wherein the at least one metal pad has a first dimension and a second dimension substantially perpendicular to the first dimension;
- wherein the at least one opening has a first dimension and a second dimension substantially perpendicular to the first dimension;
- wherein the first dimension of the at least one metal pad is substantially parallel to the first dimension of the at least one opening;
- wherein the second dimension of the at least one metal pad is substantially parallel to the second dimension of the at least one opening;
- wherein the first dimension of the at least one opening is greater than or equal to the first dimension of the at least one metal pad plus two times a predefined mask registration error tolerance;
- and
- wherein the second dimension of the at least one metal pad is greater than or equal to the second dimension of the at least one opening plus two times the predefined mask registration error tolerance.
A method of manufacturing a circuit board, the method comprising:
- forming at least one metal pad from a metal layer covering a portion of a substrate;
- and
- applying a solder mask at least partly covering the metal layer and defining at least one opening, the at least one opening corresponding to the at least one metal pad such that opposing first and second edges of the metal pad are exposed within the at least one opening and opposing third and fourth edges of the metal pad are covered by the solder mask.
Dependencies are inferred from the claim text.