H05K 2201/0999
Circuit printed on or in housing
Official title: Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
H05K2201/0999 (Circuit printed on or in housing) appears on 339 US grants and 350 published applications in this corpus.
Search patents in H05K- Granted patents
- 339
- Published applications
- 350
- Assignees
- 278
- Inventors
- 953
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 8 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 1 |
| 2002 | 7 | 5 |
| 2003 | 8 | 5 |
| 2004 | 2 | 9 |
| 2005 | 3 | 11 |
| 2006 | 9 | 9 |
| 2007 | 3 | 4 |
| 2008 | 3 | 11 |
| 2009 | 5 | 11 |
| 2010 | 4 | 3 |
| 2011 | 9 | 4 |
| 2012 | 4 | 15 |
| 2013 | 6 | 13 |
| 2014 | 10 | 15 |
| 2015 | 5 | 27 |
| 2016 | 20 | 23 |
| 2017 | 23 | 21 |
| 2018 | 23 | 21 |
| 2019 | 24 | 20 |
| 2020 | 22 | 28 |
| 2021 | 18 | 26 |
| 2022 | 16 | 14 |
| 2023 | 21 | 17 |
| 2024 | 12 | 18 |
| 2025 | 14 | 11 |
| 2026 | 11 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structural enclosure for protection against foreign object debris and restraint of thermal interface material15 Sep 2026US 12,739,978 B2Raytheon Company
- Base member, electronic device, and structure2 Jun 2026US 12,648,078 B2Canon Kabushiki Kaisha
- Housing part for a sensor28 Apr 2026US 12,613,258 B2Balluff GmbH
- Smart conduit plug21 Apr 2026US 12,609,010 B2Rosemount Inc.
- Power module, and method for manufacturing same31 Mar 2026US 12,593,690 B2Amosense Co., Ltd.
- Base member, electronic device, and structure17 Sep 2026US 2026/0282217 A1Canon Kabushiki Kaisha
- Solder joint cooling system6 Aug 2026US 2026/0231319 A1Delta Electronics (Thailand) Public Co., Ltd.
- Circuit board coupling structure21 May 2026US 2026/0143612 A1LG Energy Solution, Ltd.
- Electrical device, method for producing an electrical device7 May 2026US 2026/0130269 A1Schaeffler Technologies AG & Co. KG
- Board, board assembly method, and communication device23 Apr 2026US 2026/0113847 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Electric junction box for an automotive vehicle99US 5,995,380 ALear Automotive Dearborn, Inc. · 1999
- Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit96US 6,437,673 B1Canon Kabushiki Kaisha · 2002
- Moldable/foldable radio housing86US 4,939,792 AMotorola, Inc. · 1990