US 12,593,690 B2Granted

Power module, and method for manufacturing same

AssigneeAmosense Co., Ltd.

InventorsJihyung Lee, Taeho Cho, Intae Yeo, Jinhyuck Bin, Seunggon Park

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Abstract

The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate; an upper ceramic substrate which is disposed spaced apart from the upper portion of the lower ceramic substrate, and on the lower surface of which a semiconductor chip is mounted; spacers each having one end bonded to the lower ceramic substrate and the other end bonded to the upper ceramic substrate; first bonding layers each bonding the one end of each spacer to the lower ceramic substrate; and second bonding layers each bonding the other end of each spacer to the upper ceramic substrate. The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.

Claims17

Dependent claims

A power module comprising:

a lower ceramic substrate;
an upper ceramic substrate disposed over the lower ceramic substrate in a way to be spaced apart from the lower ceramic substrate and configured to have a semiconductor chip mounted on a lower surface of the upper ceramic substrate;
a spacer configured to have one end bonded to the lower ceramic substrate and have the other end opposite to the one end bonded to the upper ceramic substrate;
a first bonding layer configured to bond the one end of the spacer to the lower ceramic substrate;
and
a second bonding layer configured to bond the other end of the spacer to the upper ceramic substrate,
wherein the first bonding layer is formed of a thin film having a three-layer structure consisting of a Ti layer, an Ag layer, and a Cu layer, and the spacer is brazed to the lower ceramic substrate through the first bonding layer, and
wherein the Ti layer is formed as a seed layer on the one end of the spacer by a sputtering method, and the Ag layer and the Cu layer are sequentially formed on the Ti layer by a sputtering method so that the first bonding layer having the Ti—Ag—Cu three-layer structure is formed at the one end of the spacer.

5 more elements

A method of manufacturing a power module, comprising:

preparing the lower ceramic substrate;
preparing the upper ceramic substrate;
preparing a spacer;
forming a first bonding layer at one end of the spacer,
wherein forming the first bonding layer comprises:
forming, on the one end of the spacer, a Ti layer as a seed layer by a sputtering method;
and
sequentially forming an Ag layer and a Cu layer on the Ti layer by the sputtering method,
thereby forming the first bonding layer as a thin film having a three-layer structure consisting of the Ti layer, the Ag layer, and the Cu layer;
brazing the one end of the spacer to an upper surface of the lower ceramic substrate through a medium of the first bonding layer;
forming a second bonding layer at the other end of the spacer;
and
bonding the upper ceramic substrate to the other end of the spacer through a medium of the second bonding layer.

10 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/013,878Filed 24 Jun 2021
Priority: KR 10-2020-00814762 Jul 2020
Published: US 2023/0326827 A112 Oct 2023
Granted: 31 Mar 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification16 codes

H10W 40/255
Characterised by their materials: having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
H05K 3/0061
Laminating printed circuit boards onto other substrates, e.g. metallic substrates: onto a metallic substrate, e.g. a heat sink
H10W 70/095
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: of vias therein
H10W 70/099
Package substrates; Interposers; Redistribution layers [RDL]: connecting interconnections to insulating or insulated package substrates,…