H05K 2201/09981
Metallised walls
H05K2201/09981 (Metallised walls) appears on 271 US grants and 231 published applications in this corpus.
Search patents in H05K- Granted patents
- 271
- Published applications
- 231
- Assignees
- 164
- Inventors
- 637
- Latest grant
- 14 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 8 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 1 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 2 |
| 2002 | 9 | 14 |
| 2003 | 10 | 14 |
| 2004 | 10 | 12 |
| 2005 | 11 | 22 |
| 2006 | 11 | 21 |
| 2007 | 16 | 25 |
| 2008 | 10 | 20 |
| 2009 | 6 | 14 |
| 2010 | 14 | 11 |
| 2011 | 7 | 4 |
| 2012 | 12 | 4 |
| 2013 | 7 | 7 |
| 2014 | 4 | 2 |
| 2015 | 3 | 5 |
| 2016 | 5 | 5 |
| 2017 | 4 | 4 |
| 2018 | 5 | 3 |
| 2019 | 1 | 1 |
| 2020 | 3 | 5 |
| 2021 | 3 | 8 |
| 2022 | 10 | 5 |
| 2023 | 6 | 11 |
| 2024 | 5 | 4 |
| 2025 | 3 | 4 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing a waveguide, circuit device and radar system14 Oct 2025US 12,444,821 B2Infineon Technologies AG
- Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface3 Jun 2025US 12,324,091 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Optical module assembly, optical module, package for optical module and flexible printed board8 Apr 2025US 12,273,991 B2Sumitomo Electric Industries, Ltd.
- LED tube lamp24 Dec 2024US 12,173,855 B2Jiaxing Super Lighting Electric Appliance Co., Ltd
- LED tube lamp10 Sep 2024US 12,085,263 B2Jiaxing Super Lighting Electric Appliance Co., Ltd
- Component Carrier With Vertically Connected Cavity Sub-Portions30 Jul 2026US 2026/0223704 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board30 Apr 2026US 2026/0122771 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate5 Feb 2026US 2026/0040448 A1Ibiden Co., Ltd.
- Printed circuit board and manufacturing method for the same1 Jan 2026US 2026/0006714 A1Samsung Electro-Mechanics Co., Ltd.
- Printed wiring board12 Jun 2025US 2025/0194008 A1KYOCERA Corporation
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Printed circuit board through hole technique143US 4,964,948 AProtoCAD, Inc. · 1990
- Multilayer printed circuit board and high-frequency circuit device using the same136US 5,828,555 AFujitsu Limited · 1998
- Apparatus and method for flat circuit assembly128US 5,600,175 ATexas Instruments Incorporated · 1997
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986