Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Hyun HAN, Yong Wan JI, Dong Keun LEE
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Abstract
The present disclosure relates to a printed circuit board including: a glass layer; a cavity penetrating between an upper surface and a lower surface of the glass layer; a metal layer disposed on a wall surface of the cavity; and an electronic component at least partially disposed in the cavity and spaced apart from the metal layer, and an upper surface of the metal layer is disposed on substantially the same level as the upper surface of the glass layer, or is disposed below the upper surface of the glass layer, and a lower surface of the metal layer is disposed on substantially the same level as the lower surface of the glass layer, or is disposed above the lower surface of the glass layer.
Claims16
A printed circuit board, comprising:
- a glass layer;
- a cavity penetrating between an upper surface and a lower surface of the glass layer;
- a metal layer disposed on a wall surface of the cavity;
- and
- an electronic component at least partially disposed in the cavity and spaced apart from the metal layer,
- wherein an upper surface of the metal layer is disposed on substantially the same level as the upper surface of the glass layer, or is disposed below the upper surface of the glass layer, and
- a lower surface of the metal layer is disposed on substantially the same level as the lower surface of the glass layer, or is disposed above the lower surface of the glass layer.
A printed circuit board, comprising:
- a glass layer;
- a cavity penetrating through at least a portion of a space between an upper surface and a lower surface of the glass layer;
- a metal layer disposed on a wall surface of the cavity;
- and
- an electronic component at least partially disposed in the cavity and spaced apart from the metal layer,
- wherein the metal layer includes a first metal layer disposed on the wall surface of the cavity and a second metal layer disposed on the first metal layer,
- wherein the first metal layer includes a stack structure of a titanium layer and a copper layer, and
- the second metal layer includes a copper layer.
Dependencies are inferred from the claim text.