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US 5,828,555 AGranted
Multilayer printed circuit board and high-frequency circuit device using the same
AssigneeFujitsu Limited
InventorTakumi Itoh
Life of this patent
Estimating the term…
Abstract
A multilayer printed-circuit board includes at least one inner-layer signal line, first and second ground layers between which the inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board, and metallic wall members which are provided on inner walls of slits formed in the frame member and extending along the inner-layer signal line. The first and second ground layers and the metallic wall members shielding the inner-layer signal line.
Claims12
A multilayer printed-circuit board comprising:
- at least one inner-layer signal line;
- first and second ground layers between which said at least one inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board;
- and
- metallic wall members provided on inner walls of slits formed in the frame member and extending along said at least one inner-layer signal line,
- said first and second ground layers and said metallic wall members shielding said at least one inner-layer signal line.
2 more elements
A circuit device comprising:
- printed-circuit boards on which circuit parts are provided;
- a back board to which the printed-circuit boards are attached and arranged side by side;
- first connectors provided to the printed-circuit boards;
- and
- second connectors provided to the back board and engaged with the first connectors provided to the printed-circuit boards,
- each of the printed-circuit boards and the back boards comprising:
- at least one inner-layer signal line connected to one of the first and second connectors;
- first and second ground layers between which said at least one inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board;
- and
- metallic wall members provided on inner walls of slits formed in the frame member and extending along said at least one inner-layer signal line,
- said first and second ground layers and said metallic wall members shielding said at least one inner-layer signal line.
8 more elements
Dependencies are inferred from the claim text.