Optical module assembly, optical module, package for optical module and flexible printed board
AssigneeSumitomo Electric Industries, Ltd.
InventorsTaichi Misawa, Keiji Tanaka
Life of this patent
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AssigneeSumitomo Electric Industries, Ltd.
InventorsTaichi Misawa, Keiji Tanaka
Estimating the term…
A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer includes a first ground pattern and a first insulating layer disposed between the first wiring layer and the second wiring layer, and includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view, and the first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.
A package for an optical module comprising:
Dependencies are inferred from the claim text.