Apparatus and method for flat circuit assembly
AssigneeTexas Instruments Incorporated
InventorKurt Orthmann
Life of this patent
Estimating the term…
Abstract
A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the cavities (22, 24) or they may be secured therein by the use of adhesives and/or solder. Electrical connection between the integrated circuits (16) and circuit components (14) may be done with wire bonding, ribbon bonding, tape-automated bonding, lead frames, flip chip bonding, and/or conductive gluing of leads. The circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions set by the International Standards Organization.
Claims9
A transponder circuit assembly having a thickness less than 760 .mu.m, comprising:
- a circuit component;
- an integrated circuit;
- an antenna;
- a carrier having a thickness less than that of the integrated circuit and circuit component, said carrier defining a shallow cavity properly sized for accommodating said integrated circuit and capacitor;
- and
- electrical connectors connecting said integrated circuit and circuit component.
Dependencies are inferred from the claim text.