H05K 2201/09927
Machine readable code
Official title: Machine readable code, e.g. bar code
H05K2201/09927 (Machine readable code) appears on 70 US grants and 63 published applications in this corpus.
Search patents in H05K- Granted patents
- 70
- Published applications
- 63
- Assignees
- 72
- Inventors
- 172
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 3 | 1 |
| 2003 | 0 | 3 |
| 2004 | 1 | 1 |
| 2005 | 2 | 6 |
| 2006 | 1 | 4 |
| 2007 | 2 | 4 |
| 2008 | 3 | 3 |
| 2009 | 3 | 4 |
| 2010 | 2 | 4 |
| 2011 | 4 | 2 |
| 2012 | 1 | 1 |
| 2013 | 2 | 0 |
| 2014 | 1 | 3 |
| 2015 | 2 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 2 | 2 |
| 2019 | 1 | 5 |
| 2020 | 3 | 2 |
| 2021 | 2 | 4 |
| 2022 | 3 | 3 |
| 2023 | 1 | 4 |
| 2024 | 3 | 2 |
| 2025 | 2 | 0 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board and wiring circuit board assembly sheet25 Aug 2026US 12,720,677 B2Nitto Denko Corporation
- Display device and method of manufacturing the same7 Jul 2026US 12,677,567 B2Samsung Display Co., Ltd.
- Method for making a lighting device10 Feb 2026US 12,550,264 B2Signify Holding B. V.
- Roll-to-roll additive manufacturing method and device12 Aug 2025US 12,389,551 B2
- Electronic component module8 Jul 2025US 12,356,538 B2Murata Manufacturing Co., Ltd.
- Display device and method of manufacturing the same24 Sep 2026US 2026/0293498 A1Samsung Display Co., Ltd.
- Roll-To-Roll Additive Manufacturing Method and Device11 Jun 2026US 2026/0164564 A1Trackonomy Systems, Inc.
- Apparatus for Treating a Surface of a Printed Circuit Board, Printed Circuit Board with Multi-Profiled Portion, and Method14 May 2026US 2026/0136469 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring circuit board and wiring circuit board assembly sheet18 Jul 2024US 2024/0244742 A1Nitto Denko Corporation
- A method for making a lighting device25 Jan 2024US 2024/0032199 A1Signfy Holding B.V.
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections34US 4,528,259 A1985
- Additive printed circuit boards with flat surface and indented primary wiring conductors31US 4,775,611 A1988
- Heat and solvent resistant pressure-sensitive label29US 5,273,798 AWatson Label Products, Corp. · 1993
- Combined electromagnetic and optical communication system28US 7,284,704 B2International Barcode Corporation · 2007