Electronic component module

A module comprising:

• a substrate;
• a component mounted on a top surface being one principal surface of the substrate;
• a first shielding film provided on a top surface and a side surface of the component;
• a sealing resin provided on the top surface of the substrate and sealing the component;
• and
• a second shielding film provided on a top surface of the sealing resin, wherein
• a hole is provided on the top surface of the sealing resin to reach at least a part of the first shielding film,
• the hole includes a first area overlapping with the top surface of the component and a second area not overlapping with the top surface of the component in a plan view of the sealing resin,
• the second shielding film provided in the hole is brought into contact with the first shielding film at a first position facing the top surface of the component, the first position being inside the first area, and is brought into contact with the first shielding film at a second position facing the side surface of the component, the second position being inside the second area,
• a recess is provided on the top surface of the sealing resin in a manner recessed toward the top surface of the substrate,
• each of depths of the hole in the first area and the second area is greater than a depth of the recess, and
• each of the hole and the recess delineates an identifier including at least one of a character, a number, a symbol, a dot-shaped recognition code, a barcode, a two-dimensional code, a logo, and a graphic, in a plan view of the sealing resin.