Roll-To-Roll Additive Manufacturing Method and Device
AssigneeTrackonomy Systems, Inc.
InventorsHendrik J. Volkerink, Ajay Khoche
Life of this patent
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Abstract
A flexible laminate electronic device includes a flexible substrate that includes electrical connections between electronic components attached to the flexible substrate. A first flexible additive layer includes apertures, wherein at least one of the one or more electronic components is aligned in one of the apertures. A subsequent flexible additive layer is disposed over the first flexible additive layer and aligned around respective portions of the electronic components protruding above the first flexible additive layer. A flexible cover layer is placed over the subsequent flexible additive layer.
Claims7
A method comprising:
- dispensing a flexible substrate from a roll;
- placing a plurality of electronic components on a dispensed portion of the flexible substrate;
- receiving a set of profile heights of the plurality of electronic components:
- determining a set of additive layer thicknesses based on the set of profile heights, the set of additive layer thicknesses including a first thickness and a subsequent thickness;
- dispensing a first additive layer from a roll, the first additive layer having a thickness corresponding to the first thickness and comprising at least a first set of apertures;
- positioning the first additive layer on the flexible substrate, wherein each of the plurality of electronic components are aligned in a respective aperture of the first set of apertures;
- dispensing a second additive layer from a roll, the second additive layer having a thickness corresponding to the subsequent thickness and comprising at least a second set of apertures;
- positioning the second additive layer over the first flexible additive layer, aligning the second set of apertures around respective portions of one or more of the plurality of electronic components protruding above the first flexible additive layer;
- and
- emplacing a flexible cover layer over the second flexible additive layer.
A method comprising:
- receiving a set of profile heights of a plurality of electronic components;
- determining a set of additive layer thicknesses based on the set of profile heights, the set of additive layer thicknesses including a first thickness and a subsequent thickness;
- selecting a first additive layer having the first thickness;
- selecting a second additive layer having the subsequent thickness;
- and
- assembling a flexible electronic device comprising the plurality of electronic devices, the first additive layer, and the second additive layer.
Dependencies are inferred from the claim text.