Printed circuit board

A printed circuit board, comprising:

• a plurality of insulating layers including a first insulating layer and a second insulating layer and having a through-portion penetrating at least a portion of the first insulating layer;
• a plurality of wiring layers respectively disposed on or in the plurality of insulating layers;
• a plurality of via layers respectively penetrating through at least a portion of at least one of the plurality of insulating layers and respectively connected to at least one of the plurality of wiring layers;
• an electronic component at least partially disposed in the through-portion, and embedded in at least one of the plurality of insulating layers;
• and
• an insulating film disposed between the first insulating layer and the second insulating layer to cover at least a portion of a side surface of the electronic component and at least a portion of a wall surface of the through-portion,
• wherein the second insulating layer includes a portion covering a portion of the insulating film on the first insulating layer, and another portion disposed in the through-portion to cover another portion of the insulating film in the through-portion.