H05K 2201/09909
Special local insulating pattern
Official title: Special local insulating pattern, e.g. as dam around component
H05K2201/09909 (Special local insulating pattern) appears on 507 US grants and 612 published applications in this corpus.
Search patents in H05K- Granted patents
- 507
- Published applications
- 612
- Assignees
- 322
- Inventors
- 1,389
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 6 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 3 | 0 |
| 1999 | 12 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 6 |
| 2002 | 14 | 18 |
| 2003 | 14 | 24 |
| 2004 | 14 | 20 |
| 2005 | 12 | 37 |
| 2006 | 13 | 40 |
| 2007 | 23 | 42 |
| 2008 | 19 | 45 |
| 2009 | 12 | 36 |
| 2010 | 24 | 31 |
| 2011 | 30 | 20 |
| 2012 | 31 | 20 |
| 2013 | 15 | 19 |
| 2014 | 14 | 27 |
| 2015 | 16 | 20 |
| 2016 | 18 | 17 |
| 2017 | 13 | 22 |
| 2018 | 20 | 14 |
| 2019 | 17 | 19 |
| 2020 | 14 | 14 |
| 2021 | 11 | 30 |
| 2022 | 17 | 25 |
| 2023 | 22 | 28 |
| 2024 | 25 | 13 |
| 2025 | 13 | 14 |
| 2026 | 6 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and semiconductor package having the same25 Aug 2026US 12,721,201 B2LG Innotek Co., Ltd.
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Electronic circuit assemblies, methods of manufacturing the same, and modules28 Apr 2026US 12,615,719 B2Pragmatic Semiconductor Limited
- Printed circuit board assembly for an aircraft solid state power controller14 Apr 2026US 12,604,418 B2Hs Elektronik Systeme GmbH
- Circuit board, semiconductor device, and method of manufacturing circuit board17 Feb 2026US 12,557,222 B2Shinko Electric Industries Co., Ltd.
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Package structure2 Jul 2026US 2026/0190236 A1Advanced Semiconductor Engineering, Inc.
- Printed circuit board assembly and manufacturing method therefor25 Jun 2026US 2026/0181789 A1Samsung Electronics Co., Ltd.
- Electrical conductor device and method for manufacturing an electrical conductor device25 Jun 2026US 2026/0182472 A1
- Printed circuit board28 May 2026US 2026/0150192 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Electrical component package comprising polymer-reinforced solder bump interconnection151US 5,120,678 AMotorola, Inc. · 1992
- Head gimbal assembly with a flexible printed circuit having a serpentine substrate121US 6,249,404 B1Read-Rite Corporation · 2001