Printed circuit board assembly for an aircraft solid state power controller
AssigneeHs Elektronik Systeme GmbH
InventorsJosef Maier, Thomas Gietzold
Life of this patent
Estimating the term…
Abstract
A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.
Claims12
A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising:
- at least one printed circuit board having a top side and a bottom side,
- a surface layer on at least one of the top side and the bottom side, the surface layer being made from an electrically conductive material;
- a plurality of heat generating electronic circuit components mounted on a same side as the surface layer;
- and
- an insulating potting that covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner;
- wherein the insulating potting body is made from an insulating polymeric material;
- wherein the insulating potting body comprises:
- an insulating dam material having a viscosity of between 50×103 mPas and 1000×103 mPas;
- and
- an insulating fill material having a viscosity of between 10 mPas and 49×103 mPas.
A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising:
- at least one printed circuit board having a top side and a bottom side,
- a surface layer on at least one of the top side and the bottom side, the surface layer being made from an electrically conductive material;
- a plurality of heat generating electronic circuit components mounted on a same side as the surface layer;
- and
- an insulating potting that covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner;
- wherein the insulating potting body is formed with a three dimensional structure on its side facing away from the printed circuit board;
- wherein the three-dimensional structure includes at least one predetermined pattern of protrusions and/or recesses, thereby forming any of at least one reinforcing rib, at least one grid structure and/or at least one mesh structure, or combinations thereof;
- the SSPC further comprising an insulating potting on each of the top side and bottom side of the printed circuit board, wherein the insulating potting on the top side is formed with a first three dimensional structure on its side facing away from the printed circuit board, and the insulating potting on the bottom side is formed with a second three dimensional structure on its side facing away from the printed circuit board, wherein the first and second three dimensional structures are coordinated with each other or complementary to each other.
A method of manufacturing a printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising
- providing at least one printed circuit board having a top side and a bottom side, at least one of the top side and the bottom side having a surface layer made from an electrically conductive material and a plurality of heat generating electronic circuit components mounted thereon, and
- potting an insulating material to the at least one of top side and/or bottom side of the printed circuit board such as to cover the plurality of heat generating electronic components, thereby producing an insulating potting having the configuration of an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner;
- wherein potting an insulating material to the top side and/or bottom side of the printed circuit board such as to cover the plurality of heat generating electronic components comprises providing the insulating potting body in the configuration of a dam and fill potting by:
- first applying to the top side and/or bottom side of the printed circuit board an insulating dam material having a viscosity of 50×103 mPas or more, particularly of 100×103 mPas or more, preferably of 110×103 mPas or more, particularly at most 1000×103 mPas, and providing a dam structure forming at least one space enclosed by the insulating dam material;
- and
- then, after applying, filling structures enclosed by the dam structure of insulating dam material with an insulating fill material having a viscosity of 49×103 mPas or less, particularly of 30×103 mPas or less, preferably of 20×103 mPas or less, particularly of at least 10 mPas;
- or
- forming the insulating potting body with a three dimensional structure on its side facing away from the printed circuit board.
Dependencies are inferred from the claim text.