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US 2026/0190236 A1Published application
Package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChung Ju YU, Tsung-Wei LU
Life of this patent
Estimating the term…
Abstract
A package structure is provided. The package structure includes a substrate, an electronic component, and a protective element. The substrate includes a first pad and a second pad. The electronic component is connected to the first pad and the second pad. The protective element is at least partially situated between the substrate and the electronic component. The protective element extends over the first pad by a first length and over the second pad by a second length different from the first length.
Claims20
A package structure, comprising:
- a substrate comprising a first pad and a second pad;
- an electronic component connected to the first pad and the second pad;
- and
- a protective element at least partially between the substrate and the electronic component, wherein the protective element extends over the first pad by a first length and over the second pad by a second length different from the first length.
1 more element
A package structure, comprising:
- a substrate comprising a first pad;
- an electronic component disposed over the first pad and comprising a first terminal;
- and
- a first solder element connecting the first terminal to the first pad,
- wherein the first solder element comprises a first lower portion between the first terminal and the first pad and having a first thickness, and the first solder element further comprises a lateral portion over a sidewall of the first terminal and having a second thickness less than the first thickness.
2 more elements
A package structure, comprising:
- a substrate comprising a first pad exposed from an upper surface of the substrate;
- a first electronic component comprising a first electrode and a first solder element covering the first electrode;
- and
- a first solder structure connecting the first solder element to the first pad, wherein a contact surface between the first solder element and the first solder structure comprises an irregular surface.
1 more element
Dependencies are inferred from the claim text.