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US 12,557,222 B2Granted
Circuit board, semiconductor device, and method of manufacturing circuit board
AssigneeShinko Electric Industries Co., Ltd.
InventorsHikaru Tanaka, Takahiko Kiso, Aya Mashima
Life of this patent
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Abstract
A circuit board includes an insulating layer that is layered on a substrate; and a dam member in a form of a rectangular frame that is formed on the insulating layer. A corner part of the dam member includes a slope that slopes down from an inner wall surface to a surface of the insulating layer in a lower part that makes contact with the surface of the insulating layer; and a perpendicular part that is perpendicular to the surface of the insulating layer in an upper part separated from the surface of the insulating layer.
Claims20
A circuit board comprising:
- a substrate including a circuit layer:
- an insulating layer that covers the circuit layer and is layered on the substrate;
- a connection bump that penetrates the insulating layer and is formed on the circuit layer;
- and
- a dam member in a form of a rectangular frame that is formed on the insulating layer and is arranged around the connection bump;
- wherein a corner part of the dam member includes
- a slope that slopes down from an inner wall surface to a surface of the insulating layer in a lower part that makes contact with the surface of the insulating layer;
- a perpendicular part that is perpendicular to the surface of the insulating layer in an upper part separated from the surface of the insulating layer;
- and
- a receding part that is formed on an outer wall surface of the corner part and recedes in a lower part of the outer wall surface that makes contact with the surface of the insulating layer.
7 more elements
A semiconductor device comprising:
- a substrate including a circuit layer;
- an insulating layer that covers the circuit layer and that is layered on the substrate;
- a connection bump that penetrates the insulating layer and that is formed on the circuit layer;
- an electronic part that is placed such that the electronic part is electrically connected to the connection bump;
- a dam member in a form of a rectangular frame that is arranged around a mount area in which the electronic part is placed;
- and
- an underfill that is supplied to the mount area,
- wherein a corner part of the dam member includes
- a slope that slopes down from an inner wall surface to a surface of the insulating layer in a lower part that makes contact with the surface of the insulating layer;
- a perpendicular part that is perpendicular to the surface of the insulating layer in an upper part separated from the surface of the insulating layer;
- and
- a receding part that is formed on an outer wall surface of the corner part and recedes in a lower part of the outer wall surface that makes contact with the surface of the insulating layer.
9 more elements
Dependencies are inferred from the claim text.