H05K 2201/09954
More mounting possibilities
Official title: More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
H05K2201/09954 (More mounting possibilities) appears on 291 US grants and 249 published applications in this corpus.
Search patents in H05K- Granted patents
- 291
- Published applications
- 249
- Assignees
- 207
- Inventors
- 631
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 7 | 0 |
| 2000 | 9 | 0 |
| 2001 | 10 | 2 |
| 2002 | 7 | 5 |
| 2003 | 9 | 19 |
| 2004 | 14 | 16 |
| 2005 | 5 | 12 |
| 2006 | 13 | 16 |
| 2007 | 8 | 17 |
| 2008 | 14 | 31 |
| 2009 | 11 | 30 |
| 2010 | 18 | 24 |
| 2011 | 17 | 10 |
| 2012 | 15 | 4 |
| 2013 | 12 | 7 |
| 2014 | 8 | 6 |
| 2015 | 7 | 11 |
| 2016 | 3 | 8 |
| 2017 | 11 | 3 |
| 2018 | 6 | 3 |
| 2019 | 4 | 3 |
| 2020 | 1 | 2 |
| 2021 | 6 | 6 |
| 2022 | 3 | 0 |
| 2023 | 1 | 4 |
| 2024 | 4 | 3 |
| 2025 | 1 | 4 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Soldering board arrangement3 Mar 2026US 12,568,580 B2PHYTEC Messtechnik GmbH
- Circuit board and image forming apparatus6 May 2025US 12,295,096 B2Canon Kabushiki Kaisha
- Modular electronic prototyping platforms24 Dec 2024US 12,177,969 B2Microsoft Technology Licensing, LLC
- Electrical circuit board8 Oct 2024US 12,109,955 B2Yazaki Corporation
- Array substrate and method of mounting integrated circuit using the same23 Apr 2024US 11,967,597 B2Samsung Display Co., Ltd.
- Methods and apparatus to enable attachment of surface mount technology (smt) components of different sizes to an underlying substrate13 Aug 2026US 2026/0239532 A1Intel Corporation
- Solder area formed to capture two wires6 Aug 2026US 2026/0229801 A1Kollmorgen Corporation
- Printed circuit board, image forming apparatus, and system4 Jun 2026US 2026/0156745 A1Canon Kabushiki Kaisha
- Circuit board, circuit board assembly, and electronic device9 Oct 2025US 2025/0318050 A1Honor Device Co., Ltd.
- Circuit board and image forming apparatus24 Jul 2025US 2025/0240881 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Memory device supporting a dynamically configurable core organization220US 6,889,304 B2Rambus Inc. · 2005
- Interconnect adapter and head suspension assembly185US 6,025,988 ARead-Rite Corporation · 2000
- SIMM/DIMM memory module156US 6,111,757 AInternational Business Machines Corporation · 2000
- Memory module121US 6,038,132 AMitsubishi Denki Kabushiki Kaisha · 2000