Solder area formed to capture two wires
AssigneeKollmorgen Corporation
InventorMartin DOLEŽAL
Life of this patent
Estimating the term…
Abstract
A printed circuit board assembly is provided for electrically connecting a bifilar winding to a single solder pad. The assembly includes a solder pad and a wire capture area formed in the printed circuit board adjacent the solder pad. The wire capture area defines a guided wire path configured to receive two wires of a bifilar winding and mechanically constrain the wires relative to one another and relative to the solder pad. In various embodiments, the guided wire path includes a uniform channel and a wedge area that cooperate to laterally compress and wedge the wires together, converting elastic restoring forces of the wires into contact forces that maintain exposed conductor portions of both wires in contact with the solder pad during soldering.
Claims15
A printed circuit board assembly comprising:
- a printed circuit board including a first surface defining a solder pad;
- and a second surface defining a wire capture area formed in the printed circuit board adjacent the solder pad,
- wherein the wire capture area is configured to receive two wires of a bifilar winding and to mechanically wedge the two wires together by engagement with the second surface of the wire capture area to maintain the two wires in a fixed position relative to the solder pad during soldering.
A printed circuit board assembly comprising:
- a printed circuit board defining a solder pad configured as a single electrical node;
- and
- a slot formed in the printed circuit board adjacent the solder pad;
- wherein:
- the slot includes a uniform channel and a wedge portion,
- the uniform channel is configured to receive two wires of a bifilar winding in a single file orientation, and
- the wedge portion is configured to compress the two wires toward one another such that, when seated therein, the wedge portion and resulting elastic restoring forces of the two wires cooperate to retain the two wires in contact with the solder pad.
A printed circuit board assembly comprising:
- a printed circuit board including a solder pad;
- a wire capture area formed in the printed circuit board adjacent the solder pad;
- and
- a wire path connected to the wire capture area for guiding wired therein,
- wherein the wire capture area is configured to fix at least two wires therein and the wire path that mechanically constrains movement of the two wires in at least relative vertical displacement as the two wires are advanced toward the solder pad, such that insertion of the two wires into the wire capture area generates contact forces between the two wires and the printed circuit board that maintain exposed conductor portions of both wires in contact with the solder pad during soldering.
Dependencies are inferred from the claim text.