US 6,111,757 A · SIMM/DIMM memory module

Abstract

A memory module configured such that it can be operated as a first memory module such as a (Single In-line Memory Module) SIMM or as a second memory module such as a (Dual In-linc Memory Module) DIMM module without requiring external switching circuitry. This is accomplished by providing a memory module card with a circuit thereon that is designed to emulate a DIMM module when plugged into a DIMM socket as found in the latest computer architectures and to emulate a SIMM module when plugged into a SIMM socket as found in older computer architectures. The memory module is provided with memory devices (DRAMS or SDRAMS) and interconnecting bypass devices (CMOS transistor pairs) mounted thereon. The bypass devices and are also connected to terminal pads adjacent the first and second edges of the module, such that upon insertion of a first edge into a mating DIMM socket, the bypass devices are activated to interconnect the memory devices as, for example, a 1 bank 168 pin DIMM and upon insertion of the second edge into a SIMM socket, the memory devices are interconnected as, for example, a 2 bank 72 pin SIMM. The present invention decreases the need for manufacturing and maintaining separate SIMM and DIMM inventories and provides the capability of extending and expanding existing computer systems if the memory modules or cards originally designed for the computer are deleted from future inventories or become prohibitively expensive or difficult to locate.

Claims13

Dependent claims

A memory module card for use with computer system boards having module card receiving sockets thereon, each of said sockets containing a plurality of electrically powered contacts for contacting pads adjacent a received memory module card edge to enable circuit units on the memory module card, comprising:

a substantially planar card body comprised of insulative material having a first edge and a second edge;
said first edge being adapted to be inserted into a first module card receiving socket on a computer board and being different in length than said second edge;
said second edge being adapted to be inserted into a second module card receiving socket on a computer board;
a plurality of pads mounted along said first and said second edges of said card;
and
a plurality of memory arrays mounted on said card body and connected, through a plurality of semiconductor devices, to selected pads mounted along said first and second edges such that, upon insertion of said first edge into a first module card receiving socket, said semiconductor devices are selectively switched to interconnect all of said memory arrays as a first memory architecture and upon insertion of said second edge into a second module card receiving socket, said semiconductor devices are selectively switched to interconnect all of said memory arrays as a second memory architecture.

3 more elements

a substantially planar card body comprised of insulative material having a first edge and a second edge;
said first edge being adapted to be inserted into a first module card receiving socket on a computer board and being different in length than said second edge;
said second edge being adapted to be inserted into a second module card receiving socket on a computer board;
a plurality of pads mounted along said first and said second edges of said card;
and
a plurality of memory arrays mounted on said card body and connected, through a plurality of semiconductor devices, to selected pads mounted along said first and second edges such that, upon insertion of said first edge into a first module card receiving socket, said semiconductor devices are selectively switched to interconnect all of said memory arrays as a first memory architecture and upon insertion of said second edge into a second module card receiving socket, said semiconductor devices are selectively switched to interconnect all of said memory arrays as a second memory architecture;
said first socket being a first DIMM socket having a selected number of electrically powered contacts for contacting pads adjacent a received memory module card edge to connect the memory arrays on the memory module card in a first bank configuration and said second socket being a second DIMM socket having a selected number of electrically powered contacts different from the number of contacts in said first DIMM socket for contacting pads adjacent a received memory module card edge to connect the memory arrays on the memory module card in a second bank configuration different from the first bank configuration;
said plurality of arrays being DRAM arrays mounted on said card body and connected, through a plurality of complementary field effect transistors, to selected pads mounted along said first and second edges such that, upon insertion of said first edge into said first DIMM card socket, said arrays are interconnected as a single bank, 16 byte wide 278 pin DIMM and upon insertion of said second edge into said second DIMM card socket, said arrays are interconnected as a dual bank 8 byte wide, 168 pin DIMM.

5 more elements

Dependencies are inferred from the claim text.

SIMM/DIMM memory module

Life of this patent

SIMM/DIMM memory module

Life of this patent

Abstract

Claims13