H05K 2201/09985
Hollow waveguide combined with printed circuit
H05K2201/09985 (Hollow waveguide combined with printed circuit) appears on 18 US grants and 30 published applications in this corpus.
Search patents in H05K- Granted patents
- 18
- Published applications
- 30
- Assignees
- 19
- Inventors
- 79
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 2 |
| 2022 | 3 | 6 |
| 2023 | 3 | 8 |
| 2024 | 5 | 4 |
| 2025 | 5 | 3 |
| 2026 | 1 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Waveguide comprised of stacked lower and upper plates, where the lower plate is mounted on a circuit board and has a via therein for accommodating a launcher in the via28 Apr 2026US 12,614,830 B2Amosense Co., Ltd.
- Wiring board comprising three or more insulating layers, where a post wall waveguide of staircase shape is formed therein23 Dec 2025US 12,506,241 B2Shinko Electric Industries Co., Ltd.
- Interposers with millimeter-wave transitions21 Oct 2025US 12,451,579 B2NXP B. V.
- Flexible printed circuit board with embedded optical waveguide structure14 Oct 2025US 12,446,149 B2Cyntec Co., Ltd.
- Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface3 Jun 2025US 12,324,091 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Electrical conductor device and method for manufacturing an electrical conductor device25 Jun 2026US 2026/0182472 A1
- Semiconductor package including optical printed circuit board30 Apr 2026US 2026/0122776 A1Samsung Electronics Co., Ltd.
- Printed circuit board26 Mar 2026US 2026/0089835 A1Samsung Electronics Co., Ltd.
- Devices Including Substrate Structure With Laterally Offset Ground Vias And Metal Balls12 Mar 2026US 2026/0075712 A1Mediatek Inc.
Most cited
By later US patents
- Monolithic microwave integrated circuit2US 8,339,790 B2Raytheon Company · 2012
- Hybrid multi-layered optical flexible printed circuit device and manufacturing method thereof1US 11,493,711 B2AuthenX Inc. · 2022
- Surface-mount waveguide for vertical transitions of a printed circuit board1US 11,757,166 B2Aptiv Technologies AG · 2023
- Phase shifter, antenna, and base station1US 12,069,801 B2Huawei Technologies Co., Ltd. · 2024
- Antenna-to-printed circuit board transition1US 12,224,502 B2Aptiv Technologies AG · 2025