Semiconductor package including optical printed circuit board

A semiconductor package comprising:

• an optical printed circuit board (PCB);
• and
• an integrated circuit device on the optical PCB,
• wherein the optical PCB comprises:
• a base layer;
• a lower photoimageable dielectric (PID) layer on the base layer;
• an upper PID layer on the lower PID layer;
• a horizontal optical waveguide extending in a horizontal direction in the lower PID layer;
• a first via optical waveguide on a first side of the horizontal optical waveguide, in optical communication with the horizontal optical waveguide, and extending in a direction perpendicular to the lower PID layer and perpendicular to the upper PID layer;
• and
• a second via optical waveguide on a second side of the horizontal optical waveguide, in optical communication with the horizontal optical waveguide, and extending perpendicular to the lower PID layer and perpendicular to the upper PID layer.

A semiconductor package comprising:

• an optical printed circuit board (PCB);
• and
• an integrated circuit device on the optical PCB,
• wherein the optical PCB comprises:
• a base layer;
• a base optical waveguide extending in a horizontal direction and a vertical direction in the base layer;
• a photoimageable dielectric (PID) layer on the base layer;
• a first via optical waveguide on a first side of the base optical waveguide, in optical communication with the base optical waveguide, and extending perpendicular to the PID layer;
• and
• a second via optical waveguide on a second side of the base optical waveguide, in optical communication with the base optical waveguide, and extending perpendicular to the PID layer.