Hybrid multi-layered optical flexible printed circuit device and manufacturing method thereof

A method for manufacturing a hybrid multi-layered optical flexible printed circuit device, comprising the steps of:

• providing an optical flexible substrate with a first surface and a second surface opposite to each other;
• forming an intrinsic film including a first bonding region and a second bonding region on the first surface of the optical flexible substrate;
• forming a first open window aligned with the first bonding region and a second open window aligned with the second bonding region on the optical flexible substrate;
• forming an optical waveguide film on the second surface of the optical flexible substrate and encompassed the first open window and the second open window;
• forming a first flexible printed circuit board including first metal traces, a first open region aligned with the first open window and a second open region aligned with the second open window on the optical waveguide film, and/or forming a second flexible printed circuit board including second metal traces, a third open region aligned with the first open window and a fourth open region aligned with the second open window on the intrinsic film;
• forming a first notch with a first slant surface aligned with the first bonding region on the optical waveguide film, and a second notch with a second slant surface aligned with the second bonding region on the optical waveguide film;
• and
• mounting a first optoelectronic device and a second optoelectronic device respectively in the first bonding region and the second bonding region;
• wherein, the first optoelectronic device is used to convert electrical signals into optical intensity signals and emit into the waveguide film thereafter, and the second optoelectronic device is used to convert optical intensity signals received from the waveguide film into electrical signals.