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US 12,451,579 B2Granted
Interposers with millimeter-wave transitions
AssigneeNXP B.V.
InventorsAbdellatif Zanati, Jonas Ove Harm, Adrianus Buijsman
Life of this patent
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Abstract
A compact integrated circuit (IC) that outputs millimeter-wave energy can be assembled into a highly compact package that can utilize ultrasmall contacts and/or contacts arrange with nonstandard pitch. The millimeter-wave IC can be assembled onto an interposer that includes an integrated transition configured to be coupled to a millimeter-wave waveguide on a printed circuit board having contacts that have a standardized size and pitch.
Claims16
A system comprising:
- an integrated circuit (IC) disposed within an IC package;
- an interposer circuit board (“interposer”) that includes a transition structure configured to couple millimeter-wave energy received from the integrated circuit via a first set of contact pads on a top surface of the interposer into a waveguide structure integrally formed within a volume of the interposer between the top surface of the interposer and a bottom surface of the interposer;
- wherein the transition structure is configured to direct millimeter-wave energy received at the top surface of the interposer to propagate away from the top surface of the interposer toward the bottom surface of the interposer via the waveguide structure;
- wherein the interposer is configured to be physically coupled to the IC via the first set of contact pads corresponding to external contact pads of the IC package;
- wherein the interposer includes a second set of contact pads on a bottom surface of the interposer that is opposite the top surface of the interposer;
- wherein the first set of contact pads includes first contact pads that are spaced apart by a first pitch;
- and
- wherein the second set of contact pads includes second contact pads that are spaced apart by a second pitch that is greater than the first pitch.
5 more elements
An interposer circuit board (“interposer”) comprising:
- a top surface having a first set of contact pads configured to be coupled to contact pads of an integrated circuit (“IC”);
- a bottom surface having a second set of contact pads configured to be coupled to a circuit board;
- a waveguide structure formed integrally within the interposer between the top surface of the interposer and the bottom surface of the interposer;
- a transition structure configured to couple millimeter-wave energy received via one or more of the contact pads on the top surface into the waveguide structure;
- and
- one or more additional electronic components that are bonded to first contact pads belonging to the first set of contact pads;
- wherein the transition structure is configured to direct millimeter-wave energy received at the top surface of the interposer to propagate away from the top surface through the waveguide structure and toward the bottom surface of the interposer.
4 more elements
A method comprising:
- bonding an integrated circuit to a first set of contact pads on an interposer circuit board (“interposer”) configured to be coupled to contact pads of the integrated circuit (“IC”);
- wherein the interposer comprises:
- a top surface having the first set of contact pads;
- a bottom surface having a second set of contact pads configured to be coupled to a first circuit board;
- a waveguide structure formed integrally within the interposer device between the top surface and the bottom surface;
- and
- a transition structure configured to couple millimeter-wave energy received via one or more of the contact pads on the top surface into the waveguide structure;
- wherein the transition structure is configured to direct millimeter-wave energy received at the top surface to propagate away from the top surface through the waveguide structure and toward the bottom surface of the interposer;
- wherein the first set of contact pads includes first contact pads that are spaced apart by a first pitch;
- and
- wherein the second set of contact pads includes second contact pads that are spaced apart by a second pitch that is greater than the first pitch.
8 more elements
Dependencies are inferred from the claim text.