H05K 2201/09827
Tapered
Official title: Tapered, e.g. tapered hole, via or groove
H05K2201/09827 (Tapered) appears on 664 US grants and 773 published applications in this corpus.
Search patents in H05K- Granted patents
- 664
- Published applications
- 773
- Assignees
- 277
- Inventors
- 1,694
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 10 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 1 | 0 |
| 1997 | 6 | 0 |
| 1998 | 13 | 0 |
| 1999 | 6 | 0 |
| 2000 | 16 | 0 |
| 2001 | 17 | 11 |
| 2002 | 18 | 18 |
| 2003 | 20 | 22 |
| 2004 | 12 | 17 |
| 2005 | 14 | 21 |
| 2006 | 12 | 21 |
| 2007 | 20 | 23 |
| 2008 | 11 | 22 |
| 2009 | 11 | 20 |
| 2010 | 21 | 37 |
| 2011 | 13 | 29 |
| 2012 | 22 | 25 |
| 2013 | 26 | 25 |
| 2014 | 23 | 29 |
| 2015 | 25 | 45 |
| 2016 | 23 | 30 |
| 2017 | 24 | 26 |
| 2018 | 29 | 33 |
| 2019 | 43 | 38 |
| 2020 | 26 | 39 |
| 2021 | 38 | 27 |
| 2022 | 22 | 30 |
| 2023 | 16 | 44 |
| 2024 | 29 | 36 |
| 2025 | 29 | 56 |
| 2026 | 20 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board1 Sep 2026US 12,727,088 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate28 Jul 2026US 12,696,394 B2Toppan Holdings Inc.
- Printed circuit board7 Jul 2026US 12,677,369 B2Samsung Electro-Mechanics Co., Ltd.
- Component carrier with protruding portions and manufacturing method30 Jun 2026US 12,672,236 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Multi-layer board17 Sep 2026US 2026/0282226 A1Tong Hsing Electronic Industries, Ltd.
- Device and method for manufacturing solid fuel microthrusters using only pcb-mems technology10 Sep 2026US 2026/0264889 A1Universidad de Sevilla
- Printed circuit board27 Aug 2026US 2026/0255473 A1Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board27 Aug 2026US 2026/0255490 A1Samsung Electro-Mechanics Co., Ltd.
- Via formation using imprint lithography and retargeting vias formed by same27 Aug 2026US 2026/0255502 A1
Most cited
By later US patents
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000
- Semiconductor interconnect having laser machined contacts223US 6,294,837 B1Micron Technology, Inc. · 2001
- Method for fabricating semiconductor components and interconnects with contacts on opposing sides179US 6,620,731 B1Micron Technology, Inc. · 2003
- Laser beam scanning method for forming via holes in polymer materials168US 4,894,115 AGeneral Electric Company · 1990