Component carrier with protruding portions and manufacturing method
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorMinwoo Lee
Life of this patent
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Abstract
A coreless component carrier includes a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure, vias that vertically interconnect the electrically conductive layer structures in the stack, and protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surface of the stack. The vias include an electrically conductive material and taper in the same direction. Methods for manufacturing the coreless component carrier are also disclosed.
Claims21
A component carrier, being a coreless component carrier, comprising:
- a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure;
- a plurality of vias that vertically interconnect the electrically conductive layer structures in the stack,
- wherein the vias comprise an electrically conductive material,
- wherein the vias are tapering vias,
- wherein the vias taper in the same direction;
- a plurality of protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surface of the stack;
- and
- an electrically conductive cover material exclusively covering an upper main surface of at least one of the plurality of protruding portions protruding from and beyond the outermost electrically conductive layer structure of the stack.
A method of manufacturing a coreless component carrier, the method comprising:
- forming a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure;
- forming a plurality of vias that vertically interconnect the electrically conductive layer structures in the stack, and filling the plurality of vias with an electrically conductive material, such that the vias are tapering vias, and taper in the same direction;
- forming a plurality of protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surface of the stack;
- and
- forming an electrically conductive cover material exclusively covering an upper main surface of at least one of the plurality of protruding portions protruding from and beyond the outermost electrically conductive layer structure of the stack.
A method of manufacturing a coreless component carrier, the method comprising:
- forming a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure;
- forming a plurality of vias that vertically interconnect the electrically conductive layer structures in the stack, and filling the plurality of vias with an electrically conductive material, so that the vias are tapering vias, and taper in the same direction;
- and
- forming a plurality of protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surface of the stack by at least partially exposing;
- the method further comprising at least one of the following features:
- wherein exposing comprises removing electrically conductive material of the outermost electrically conductive layer structure;
- wherein exposing comprises at least partially removing the electrically conductive material by wet etching.
Dependencies are inferred from the claim text.