Wiring substrate
AssigneeToppan Holdings Inc.
InventorsYuki Umemura, Takehisa Takada, Tomoyuki Ishii
Life of this patent
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Abstract
A component (capacitor) of the high-frequency circuit provided on a first surface of the glass substrate, and the bottom of the through hole in the glass substrate on the first surface have an overlapping part on the first surface. As a result, the capacitor is formed directly above the via, that is, the through hole, thereby eliminating the need for conductive wiring from the via to the capacitor. In addition, by forming a capacitor on a very flat glass substrate before forming the through hole, and forming the through hole after that, it is possible to stably form the capacitor.
Claims10
A wiring substrate comprising a glass substrate having a through hole and a capacitor on a first surface of the glass substrate,
- wherein a bottom of the through hole on the first surface and the component forming the high-frequency circuit have an overlapping part on the first surface;
- the capacitor comprises (a) a first conductive layer in direct contact with the first surface of the glass substrate over the through hole, (b) an insulator layer over and in direct contact with the first conductive layer and (c) a second conductive layer over and in direct contact with the insulator layer, the first conductive layer being flush and parallel with the first surface of the glass substrate.
A wiring substrate comprising (ii) a glass substrate having a through hole;
- (ii) a component forming a high-frequency circuit on a first surface of the glass substrate, (iii) a first conductive layer on a side wall of the through hole and (iv) a dielectric material in a central part of the through hole, the dielectric material being surrounded by the first conductive layer and in direct contact with the first conductive layer
- wherein a bottom of the through hole on the first surface and the component forming the high-frequency circuit have an overlapping part on the first surface.
Dependencies are inferred from the claim text.