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AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood, David R. Hembree
Estimating the term…
A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The conductive members include enlarged terminal portions that are covered with a non-oxidizing metal. The method can be used to fabricate stackable semiconductor packages having integrated circuits in electrical communication with the external contacts. The method can also be used to fabricate interconnects for electrically engaging packages, dice and wafers for testing or for constructing electronic assemblies.
A method for fabricating a semiconductor component or an interconnect for semiconductor components comprising:
A method for fabricating a semiconductor component or an interconnect for semiconductor components comprising:
A method for fabricating a semiconductor component or an interconnect for semiconductor components comprising:
A method for fabricating a semiconductor component or an interconnect for semiconductor components comprising:
A method for fabricating a semiconductor component or an interconnect for semiconductor components comprising:
A method for fabricating a semiconductor component or an interconnect for semiconductor components comprising:
A method for fabricating a semiconductor component or an interconnect for semiconductor components comprising:
A method for fabricating a semiconductor component comprising:
Dependencies are inferred from the claim text.