H05K 2201/09936
Marks, inscriptions, etc. for information
H05K2201/09936 (Marks, inscriptions, etc. for information) appears on 202 US grants and 225 published applications in this corpus.
Search patents in H05K- Granted patents
- 202
- Published applications
- 225
- Assignees
- 176
- Inventors
- 539
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 2 |
| 2002 | 6 | 4 |
| 2003 | 2 | 8 |
| 2004 | 3 | 6 |
| 2005 | 6 | 11 |
| 2006 | 8 | 12 |
| 2007 | 6 | 15 |
| 2008 | 5 | 15 |
| 2009 | 6 | 8 |
| 2010 | 7 | 5 |
| 2011 | 8 | 9 |
| 2012 | 3 | 7 |
| 2013 | 4 | 7 |
| 2014 | 6 | 8 |
| 2015 | 4 | 5 |
| 2016 | 8 | 5 |
| 2017 | 6 | 11 |
| 2018 | 4 | 10 |
| 2019 | 10 | 14 |
| 2020 | 14 | 10 |
| 2021 | 10 | 8 |
| 2022 | 11 | 12 |
| 2023 | 8 | 12 |
| 2024 | 8 | 13 |
| 2025 | 11 | 6 |
| 2026 | 7 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board and wiring circuit board assembly sheet25 Aug 2026US 12,720,677 B2Nitto Denko Corporation
- Wiring substrate, method of trimming same, and multi-layered wiring board4 Aug 2026US 12,701,662 B2Mitsui Kinzoku Company, Limited
- Assembly sheet12 May 2026US 12,628,280 B2Nitto Denko Corporation
- Lighting device for a motor vehicle, comprising an illuminated screen31 Mar 2026US 12,589,690 B2Valeo Vision
- Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same17 Feb 2026US 12,557,209 B2Samsung Electronics Co., Ltd.
- Apparatus for Treating a Surface of a Printed Circuit Board, Printed Circuit Board with Multi-Profiled Portion, and Method14 May 2026US 2026/0136469 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Semiconductor package22 Jan 2026US 2026/0026357 A1Samsung Electronics Co., Ltd.
- Electronically functional multilayer structure18 Dec 2025US 2025/0386633 A1Continental Automotive Technologies GmbH
- Three-dimensional laminate shaping device6 Nov 2025US 2025/0340019 A1Fuji Corporation
- Method for manufacturing flexible printed circuit board21 Aug 2025US 2025/0267787 A1LG Energy Solution, Ltd.
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Disk drive printed circuit board with component-dedicated alignment line indicators including inner and outer line segments48US 7,381,904 B1Western Digital Technologies, Inc. · 2008
- Integrated circuit packages with distinctive coloration38US 5,644,102 ALSI Logic Corporation · 1997
- Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections34US 4,528,259 A1985
- Method of manufacturing printed circuit network devices31US 4,415,607 AAllen-Bradley Company, Inc. · 1983