Integrated circuit packages with distinctive coloration
AssigneeLSI Logic Corporation
InventorMichael D. Rostoker
Life of this patent
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AssigneeLSI Logic Corporation
InventorMichael D. Rostoker
Estimating the term…
A technique is described for providing body coloration and colored indicia for indicating one or more characteristics of an integrated circuit device. Package body coloration is one source of information about device characteristics. Other indications relate to colored indicia. The colored indicia are relatively large and easily viewable from distances too great for printed text on the package body to be read comfortably. The indicia is (are) colored other than black or white. Among the visible indicia characteristics which can be used to convey information are: indicia color (or colors on multi-colored indicia), shape, size, orientation, and/or location. Among the various integrated circuit device characteristics which can be conveyed by the indicia characteristics are: device function, device speed, level of testing, degree of rad-hardness, location of reference pin, side, corner or surface, location and function of groups of pins carrying related signals, etc. In order to facilitate assembly, colored indicia matching those on the integrated circuit devices can be printed on a printed circuit board substrate at locations and in orientations on the printed circuit corresponding to the correct assembled positions of the integrated circuit devices. Colored areas can also be incorporated into semiconductor packages to control (alter, modify) the thermal characteristics of the package, particularly in order that thermal stresses on a die operating within the package can be reduced and equalized.
Integrated circuit package having at least two different colored areas selected to equalize thermal stresses within the package caused by heat generated from an integrated circuit device contained therein, said integrated circuit package comprising:
Integrated circuit package having a plurality of different colored areas selected to equalize thermal stresses within the package caused by heat generated from an integrated circuit device contained therein, said integrated circuit package comprising:
Dependencies are inferred from the claim text.