Back to results
US 12,628,280 B2Granted
Assembly sheet
AssigneeNitto Denko Corporation
InventorsChihiro Watanabe, Kenya Takimoto
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeNitto Denko Corporation
InventorsChihiro Watanabe, Kenya Takimoto
Estimating the term…
An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.
An assembly sheet comprising:
Dependencies are inferred from the claim text.