H05K 2201/09836
Oblique hole, via or bump
H05K2201/09836 (Oblique hole, via or bump) appears on 92 US grants and 110 published applications in this corpus.
Search patents in H05K- Granted patents
- 92
- Published applications
- 110
- Assignees
- 76
- Inventors
- 233
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 3 |
| 2004 | 4 | 2 |
| 2005 | 3 | 8 |
| 2006 | 4 | 11 |
| 2007 | 3 | 5 |
| 2008 | 4 | 4 |
| 2009 | 2 | 2 |
| 2010 | 3 | 3 |
| 2011 | 4 | 3 |
| 2012 | 5 | 10 |
| 2013 | 6 | 3 |
| 2014 | 3 | 7 |
| 2015 | 5 | 6 |
| 2016 | 3 | 3 |
| 2017 | 1 | 0 |
| 2018 | 3 | 6 |
| 2019 | 4 | 6 |
| 2020 | 5 | 5 |
| 2021 | 3 | 1 |
| 2022 | 4 | 6 |
| 2023 | 1 | 4 |
| 2024 | 3 | 4 |
| 2025 | 6 | 3 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- VGA monitor emulating printed circuit board10 Feb 2026US 12,550,262 B2Alcon Inc.
- Non-planar printed circuit board (PCB) interposer for doubly curved conformal antenna array23 Dec 2025US 12,506,283 B1Rockwell Collins, Inc.
- Printed wiring board, multilayer resonator, and multilayer filter25 Nov 2025US 12,482,913 B2KYOCERA Corporation
- Systems and methods of fabricating coils for coreless transformers and inductors11 Nov 2025US 12,471,217 B2Nano Dimension Technologies, Ltd.
- Apparatus, system, and method of providing a ramped interconnect for semiconductor fabrication28 Jan 2025US 12,211,713 B2Jabil Inc.
- Via formation using imprint lithography and retargeting vias formed by same27 Aug 2026US 2026/0255502 A1
- X-cross non-circular micro vias for layer interconnect in printed wiring board23 Apr 2026US 2026/0113843 A1
- Component carrier and method for manufacturing a component carrier5 Mar 2026US 2026/0068043 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component carrier, method for manufacturing a component carrier and component carrier assembly5 Mar 2026US 2026/0068724 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Apparatus, system, and method of providing a ramped interconnect for semiconductor fabrication2 Oct 2025US 2025/0308956 A1Jabil Inc.
Most cited
By later US patents
- Method for manufacturing a probe133US 5,513,430 AMotorola, Inc. · 1996
- Circuit boards containing vias and methods for producing same112US 6,797,616 B2Micron Technology, Inc. · 2004
- Circuit boards containing vias and methods for producing same111US 6,774,486 B2Micron Technology, Inc. · 2004
- Method and apparatus to manufacture an electronic package with direct wiring pattern78US 6,459,039 B1International Business Machines Corporation · 2002
- Slanted vias for electrical circuits on circuit boards and other substrates77US 7,083,425 B2Micron Technology, Inc. · 2006