Samtec, Inc.
New Albany, IN, US· latest recorded location
SAMTEC, INC. is named on 254 US grants and 249 published applications in this corpus. Its most frequent classification is H01R (Electrically-conductive connections).
- Granted patents
- 254
- Published applications
- 249
- Inventors
- 179
- Granted in 2026 so far
- 17
- Most recent grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 1 |
| 2004 | 3 | 4 |
| 2005 | 0 | 7 |
| 2006 | 5 | 1 |
| 2007 | 5 | 6 |
| 2008 | 5 | 5 |
| 2009 | 4 | 6 |
| 2010 | 3 | 3 |
| 2011 | 5 | 4 |
| 2012 | 1 | 0 |
| 2013 | 4 | 12 |
| 2014 | 13 | 11 |
| 2015 | 15 | 8 |
| 2016 | 4 | 14 |
| 2017 | 11 | 9 |
| 2018 | 10 | 6 |
| 2019 | 8 | 11 |
| 2020 | 15 | 20 |
| 2021 | 19 | 21 |
| 2022 | 33 | 21 |
| 2023 | 21 | 17 |
| 2024 | 22 | 17 |
| 2025 | 23 | 22 |
| 2026 | 17 | 22 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 503 documents
- H01RElectrically-conductive connections262
- G02BOptical elements, systems or apparatus131
- H05KPrinted circuits113
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by64
- H04BTransmission52
- Y10TTechnical subjects covered by former us classification38
- H01BCables21
- H01PWaveguides20
- Y02PLow-carbon manufacturing17
- G01RMeasuring electric variables10
Recent patents
- Electrical connector6 Oct 2026US D1,151,495 S1Design
- Optical transceiver with versatile positioning15 Sep 2026US 12,736,763 B2
- Electrical connector28 Jul 2026US D1,137,148 S1Design
- Electrical connector30 Jun 2026US D1,132,258 S1Design
- Vertical interconnect system for high-speed data transmission2 Jun 2026US 12,646,889 B2
- Electrical connector apparatus and method1 Oct 2026US 2026/0302693 A1
- Connector and method of use without preattached solder ball17 Sep 2026US 2026/0280163 A1
- Vertical interconnect system for high-speed data transmission10 Sep 2026US 2026/0269528 A1
- Rf connector3 Sep 2026US 2026/0261085 A1
- Insulating bead for rf connector3 Sep 2026US 2026/0261088 A1
Most cited
By later US patents
- Transceiver and interface for IC package105US 8,588,561 B22013
- Transceiver and interface for IC package89US 8,787,711 B22014
- Configurable, high-bandwidth connector77US 9,843,135 B22017
- Array connector having improved electrical characteristics and increased signal pins with decreased ground pins76US 7,322,855 B22008
- Twinaxial cable and twinaxial cable ribbon69US 9,040,824 B22015