Method and apparatus to manufacture an electronic package with direct wiring pattern

A surface mount assembly comprising:

• a first substrate having a first conductive array grid with a first conductive array parameter;
• a second substrate having a second conductive array grid with a second conductive array parameter, said second conductive array parameter differing from said first conductive array parameter;
• and
• an interposer between and interconnecting said first and second substrates to spatially transform said differing conductive array parameters of said first and second substrates, said interposer comprising:
• an interposer having a top surface and a bottom surface,
• a first set of conductive arrays having a first conductive array parameter on said top surface which corresponds to said first conductive array parameter of said first substrate,
• a second set of conductive arrays having a differing second conductive array parameter on said bottom surface which corresponds to said second conductive array parameter of said second substrate,
• a plurality of conductors traversing a thickness of said interposer comprising at least a conductive material surrounded by a non-conductive material, and
• a matrix surrounding said plurality of conductors,
• whereby said non-conductive material of said conductors has a radial thickness changing as said conductors traverse through said interposer to spatially transform said differing conductive array parameters of said first and second substrates by connecting the first set of conductive arrays of the interposer to the corresponding first conductive array grid of the first substrate and connecting the second set of conductive arrays of the interposer to the second conductive array grid of the second substrate to provide an electronic package assembly having electrical interconnection therebetween.