Printed wiring board, multilayer resonator, and multilayer filter

A printed wiring board comprising:

• a dielectric layer;
• a first conductor layer;
• a second conductor layer;
• and
• a plurality of via conductors,
• wherein
• the dielectric layer has a first surface and a second surface opposite to the first surface,
• the first conductor layer lies in the first surface of the dielectric layer,
• the second conductor layer lies in the second surface of the dielectric layer,
• the plurality of via conductors each extend through the dielectric layer from the first surface to the second surface and connect the first conductor layer and the second conductor layer to each other,
• part of the printed wiring board is surrounded with the plurality of via conductors and is an overlap between the first conductor layer and the second conductor layer in a transparent plan view,
• when viewed in plan, the plurality of via conductors each have an aspect ratio greater than 1 and each have a major axis extending in a first direction and a minor axis extending in a second direction, and
• the plurality of via conductors comprise a via conductor whose major axis extends along a periphery connecting the plurality of via conductors arranged in a line,
• the printed wiring board further comprising a third conductor layer located between the first conductor layer and the second conductor layer and extending in parallel to the first surface, wherein
• two or more of the plurality of via conductors are arranged side by side in the second direction, and
• in each of the plurality of via conductors, an end portion in the first direction is at least partially in contact with the third conductor layer, and a middle portion which is a part of each of the plurality of via conductors from which the end portion is excluded is at least partially separate from the third conductor layer.