X-cross non-circular micro vias for layer interconnect in printed wiring board

Abstract

A printed circuit board (PCB) may include a first layer including a first plurality of conductive pads spaced apart from each other, a second layer including a second plurality of conductive pads spaced apart from each other, a first plurality of non-circular shaped micro vias connecting between the first plurality of conductive pads of the first layer and the second plurality of conductive pads of the second layer, a third layer including a third plurality of conductive pads spaced apart from each other, and a second plurality of non-circular shaped micro vias connecting between the second plurality of conductive pads of the second layer and the third plurality of conductive pads of the third layer. The second plurality of non-circular shaped micro vias may be rotated at an angle from the first plurality of non-circular shaped micro vias to form an offset pattern along an X-Y plane.

Dependencies are inferred from the claim text.